Composite materials - Company Ranking(11 companies in total)
Last Updated: Aggregation Period:Aug 27, 2025〜Sep 23, 2025
This ranking is based on the number of page views on our site.
Display Company Information
Company Name | Featured Products | ||
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Product Image, Product Name, Price Range | overview | Application/Performance example | |
※ We will provide an excerpt of information from a part of the series. [ CompoLloid Au: Ultra High Thermal Conductivity Graphite Gold Plat... | IGBT, CPU, GPU, high current and high frequency IC/LSI, SiC, optical communication devices, mobile communication base stations, power device... | ||
![]() Comproloid Cu
Other |
It is a composite material made of ultra-high thermal conductivity graphite plates and copper. Although copper, with a thermal conductivity ... | IGBT, heat sink, heat pipe, etc. | |
The composite material Cera makes microfabrication and various coatings (patterning) easier, and since the surface is ceramic, it allows for... | In devices related to electronic equipment and semiconductors, there are high expectations for the enhanced heat dissipation of ceramic subs... | ||
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- Featured Products
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Comproloid 1700W/mk ultra-high thermal conductivity graphite new composite material
- overview
- ※ We will provide an excerpt of information from a part of the series. [ CompoLloid Au: Ultra High Thermal Conductivity Graphite Gold Plat...
- Application/Performance example
- IGBT, CPU, GPU, high current and high frequency IC/LSI, SiC, optical communication devices, mobile communication base stations, power device...
Comproloid Cu
- overview
- It is a composite material made of ultra-high thermal conductivity graphite plates and copper. Although copper, with a thermal conductivity ...
- Application/Performance example
- IGBT, heat sink, heat pipe, etc.
Comproid Cera - Ultra High Thermal Conductivity Graphite Alumina New Composite Material
- overview
- The composite material Cera makes microfabrication and various coatings (patterning) easier, and since the surface is ceramic, it allows for...
- Application/Performance example
- In devices related to electronic equipment and semiconductors, there are high expectations for the enhanced heat dissipation of ceramic subs...
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