Composite materials - Company Ranking(6 companyies in total)
Last Updated： Aggregation Period:Jul 09, 2025〜Aug 05, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ※ We will provide an excerpt of information from a part of the series. [ CompoLloid Au: Ultra High Thermal Conductivity Graphite Gold Plated Metallized Products ] These are products formed with various thin and thick films on graphite using dry and wet methods. They are compatible with soldering and brazing, maximizing the substrate's 1700 W/mk. They do not require thermal interface materials (TIM) such as thermal grease, making them best-selling products in the CompoLloid series. [ CompoLloid Cu: Ultra High Thermal Conductivity Graphite and Copper Composite Products ] These are pseudo-isotropic thermal conductive products that transmit heat in all X-Y-Z directions, highly resistant to various mechanical processing and impacts due to the copper composite. It allows control over both the thermal conductivity itself and the direction of heat conduction. [ CompoLloid Cera: Ultra High Thermal Conductivity Graphite and Ceramic Composite Products ] This is a composite product with alumina that simultaneously solves insulation and thermal conductivity issues. Despite being a ceramic product, it achieves a high thermal conductivity of over 100 W/mk in the vertical (Z) direction. [ CompoLloid Rsn: Ultra High Thermal Conductivity Graphite and Resin Composite Products ] This product features a strong bond with carbon using high-temperature resistant epoxy resin. It offers excellent cost performance by achieving both thinness and strength. | IGBT, CPU, GPU, high current and high frequency IC/LSI, SiC, optical communication devices, mobile communication base stations, power devices, high integration memory, inverters, converters, LD, laser cutting machines, X-ray medical devices, LED, radar, heaters, heating furnaces, semiconductor manufacturing equipment, preheaters, molds, lithium-ion batteries, secondary batteries, capacitors, solar cells, solar panels, heat collection systems, motors, power supplies, Peltier, Seebeck, heat exchangers, air cooling/water cooling systems, heat storage systems, heat pumps, etc. | ||
| The composite material Cera makes microfabrication and various coatings (patterning) easier, and since the surface is ceramic, it allows for circuit formation on the surface, enabling the creation of ceramic high thermal conductivity substrates for high heat generation devices. It can accommodate fine items of about 1mm in thickness and size, as well as larger items exceeding 100mm. It also has heat resistance of approximately 650°C in an atmospheric environment. *In an inert atmosphere, it can withstand temperatures above 1000°C. | In devices related to electronic equipment and semiconductors, there are high expectations for the enhanced heat dissipation of ceramic substrates. | ||
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- Featured Products
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Comproloid 1700W/mk ultra-high thermal conductivity graphite new composite material
- overview
- ※ We will provide an excerpt of information from a part of the series. [ CompoLloid Au: Ultra High Thermal Conductivity Graphite Gold Plated Metallized Products ] These are products formed with various thin and thick films on graphite using dry and wet methods. They are compatible with soldering and brazing, maximizing the substrate's 1700 W/mk. They do not require thermal interface materials (TIM) such as thermal grease, making them best-selling products in the CompoLloid series. [ CompoLloid Cu: Ultra High Thermal Conductivity Graphite and Copper Composite Products ] These are pseudo-isotropic thermal conductive products that transmit heat in all X-Y-Z directions, highly resistant to various mechanical processing and impacts due to the copper composite. It allows control over both the thermal conductivity itself and the direction of heat conduction. [ CompoLloid Cera: Ultra High Thermal Conductivity Graphite and Ceramic Composite Products ] This is a composite product with alumina that simultaneously solves insulation and thermal conductivity issues. Despite being a ceramic product, it achieves a high thermal conductivity of over 100 W/mk in the vertical (Z) direction. [ CompoLloid Rsn: Ultra High Thermal Conductivity Graphite and Resin Composite Products ] This product features a strong bond with carbon using high-temperature resistant epoxy resin. It offers excellent cost performance by achieving both thinness and strength.
- Application/Performance example
- IGBT, CPU, GPU, high current and high frequency IC/LSI, SiC, optical communication devices, mobile communication base stations, power devices, high integration memory, inverters, converters, LD, laser cutting machines, X-ray medical devices, LED, radar, heaters, heating furnaces, semiconductor manufacturing equipment, preheaters, molds, lithium-ion batteries, secondary batteries, capacitors, solar cells, solar panels, heat collection systems, motors, power supplies, Peltier, Seebeck, heat exchangers, air cooling/water cooling systems, heat storage systems, heat pumps, etc.
Comproid Cera - Ultra High Thermal Conductivity Graphite Alumina New Composite Material
- overview
- The composite material Cera makes microfabrication and various coatings (patterning) easier, and since the surface is ceramic, it allows for circuit formation on the surface, enabling the creation of ceramic high thermal conductivity substrates for high heat generation devices. It can accommodate fine items of about 1mm in thickness and size, as well as larger items exceeding 100mm. It also has heat resistance of approximately 650°C in an atmospheric environment. *In an inert atmosphere, it can withstand temperatures above 1000°C.
- Application/Performance example
- In devices related to electronic equipment and semiconductors, there are high expectations for the enhanced heat dissipation of ceramic substrates.
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